Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

被引:95
作者
Gain, Asit Kumar [1 ]
Chan, Y. C. [1 ]
Yung, Winco K. C. [2 ]
机构
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon Tong, Hong Kong, Peoples R China
[2] Hong Kong Polytech Univ, Dept Ind & Syst Engn, Kowloon, Hong Kong, Peoples R China
关键词
MECHANICAL-PROPERTIES; INTERFACIAL REACTION; JOINTS; RELIABILITY; INTERMETALLICS;
D O I
10.1016/j.microrel.2011.03.042
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Nano-sized, nonreacting, noncoarsening ZrO2 particles reinforced Sn-3.0 wt%Ag-0.5 wt%Cu composite solders were prepared by mechanically dispersing ZrO2 nano-particles into Sn-Ag-Cu solder. The interfacial morphology of unreinforced Sn-Ag-Cu solder and solder joints containing ZrO2 nano-particles with Au/Ni metallized Cu pads on ball grid array (BGA) substrates and the distribution of reinforcing particles were characterized metallographically. At their interfaces, a Sn-Ni-Cu intermetallic compound (IMC) layer was found in both unreinforced Sn-Ag-Cu and Sn-Ag-Cu solder joints containing ZrO2 nano-particles and the IMC layer thickness increased with the number of reflow cycles. In the solder ball region, AuSn4. Ag3Sn, Cu6Sn5 IMC particles and ZrO2 nano-particles were found to be uniformly distributed in the beta-Sn matrix of Sn-Ag-Cu solder joints containing ZrO2 nano-particles, which resulted in an increase in the shear strength, due to a second phase dispersion strengthening mechanism. The fracture surface of unreinforced Sn-Ag-Cu solder joints exhibited a brittle fracture mode with a smooth surface while Sn-Ag-Cu solder joints containing ZrO2 nano-particles ductile failure characteristics with rough dimpled surfaces. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2306 / 2313
页数:8
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