Effect of oxygen gas pressure on the kinetics of alumina film growth during the oxidation of Al(111) at room temperature

被引:54
|
作者
Cai, Na [1 ,2 ]
Zhou, Guangwen [1 ,2 ]
Mueller, Kathrin [3 ]
Starr, David E. [3 ]
机构
[1] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA
[2] SUNY Binghamton, Multidisciplinary Program Mat Sci & Engn, Binghamton, NY 13902 USA
[3] Brookhaven Natl Lab, Ctr Funct Nanomat, Upton, NY 11973 USA
来源
PHYSICAL REVIEW B | 2011年 / 84卷 / 12期
基金
美国国家科学基金会;
关键词
OXIDE-FILMS; THERMAL-OXIDATION; THIN-FILMS; CRYSTALS; METALS; AL2O3;
D O I
10.1103/PhysRevB.84.125445
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have studied the effect of oxygen pressure on the self-limiting oxidation of an Al(111) surface at room temperature for oxygen pressures from 1 x 10(-8) to 5 Torr. Using x-ray photoelectron spectroscopy measurements, we monitor the oxidation kinetics and the oxide film thickness for different oxidation times and pressures. After a rapid initial growth stage, the oxide film reaches a saturated thickness, which depends on the oxygen pressure. The kinetic potential, oxide growth rate, oxide film limiting thickness, and the density of oxygen anions on the oxide surface are determined by the measured oxidation kinetics. These quantities show a Langmuir isotherm dependence on the oxygen gas pressure.
引用
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页数:6
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