Mechanical and electrical responses of nanostructured Cu-3 wt%Ag alloy fabricated by ECAP and cold rolling

被引:47
作者
Ko, Young Gun [2 ]
Namgung, Seung [1 ]
Lee, Byung Uk [1 ]
Shin, Dong Hyuk [1 ]
机构
[1] Hanyang Univ, Dept Met & Mat Sci, Ansan 425791, South Korea
[2] Yeungnam Univ, Sch Mat Sci & Engn, Gyongsan 712749, South Korea
基金
新加坡国家研究基金会;
关键词
Cu-3 wt%Ag alloy; Nanostructure; Mechanical properties; Electrical conductivity; CHANNEL ANGULAR EXTRUSION; STACKING-FAULT ENERGY; GRAIN-REFINEMENT; HIGH-STRENGTH; DEFORMATION; MICROSTRUCTURE; ALUMINUM; TEMPERATURE; TI-6AL-4V; NICKEL;
D O I
10.1016/j.jallcom.2010.02.198
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper investigated the mechanical and electrical responses of nanostructured Cu-3 wt%Ag alloy as a function of the strain imposed by a combination of equal channel angular pressing and subsequent cold rolling. The influence of cold rolling on the microstructural change was observed to be pronounced, resulting in the occurrence of lamellar band structure. Room-temperature tension tests results revealed that, as the amount of strain increased, the tensile strength of the nanostructured Cu-3 wt%Ag alloy increased while losing its ductility. The electrical conductivity slightly decreased with increasing amount of strain imposed. This phenomenon was mainly attributed to the nano-grained structure together with the non-equilibrium state of the grain boundaries. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:S448 / S451
页数:4
相关论文
共 25 条
[1]   Deformation induced grain boundaries in commercially pure aluminium [J].
Chang, CP ;
Sun, PL ;
Kao, PW .
ACTA MATERIALIA, 2000, 48 (13) :3377-3385
[2]   Deformation and texture of copper-manganese alloys [J].
Engler, O .
ACTA MATERIALIA, 2000, 48 (20) :4827-4840
[3]   Development of a submicrometer-grained microstructure in aluminum 6061 using equal channel angular extrusion [J].
Ferrasse, S ;
Segal, VM ;
Hartwig, KT ;
Goforth, RE .
JOURNAL OF MATERIALS RESEARCH, 1997, 12 (05) :1253-1261
[4]  
GALLAGHER PC, 1970, METALL TRANS, V1, P2429
[5]   Microstructure and properties of Cu-11Fe-6Ag in situ composite after thermo-mechanical treatments [J].
Gao, Haiyan ;
Wang, Jun ;
Shu, Da ;
Sun, Baode .
JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 438 (1-2) :268-273
[6]   ON THE STABILITY OF COLD DRAWN, 2-PHASE WIRES [J].
HONG, SI ;
HILL, MA ;
SAKAI, Y ;
WOOD, JT ;
EMBURY, JD .
ACTA METALLURGICA ET MATERIALIA, 1995, 43 (09) :3313-3323
[7]   High-strength, high-conductivity ultra-fine grains commercial pure copper produced by ARB process [J].
Hosseini, Sayed Abdollah ;
Manesh, Habib Danesh .
MATERIALS & DESIGN, 2009, 30 (08) :2911-2918
[8]   Factors influencing the equilibrium grain size in equal-channel angular pressing: Role of Mg additions to aluminum [J].
Iwahashi, Y ;
Horita, Z ;
Nemoto, M ;
Langdon, TG .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1998, 29 (10) :2503-2510
[9]   Age hardening characteristics of Cu-Ag-Zr alloy [J].
Jia, S. G. ;
Ning, X. M. ;
Liu, P. ;
Zheng, M. S. ;
Zhou, G. S. .
METALS AND MATERIALS INTERNATIONAL, 2009, 15 (04) :555-558
[10]  
Kim YG, 2009, J KOREAN INST MET MA, V47, P397