共 29 条
- [21] Proslier T., 2009, 23 PART ACC C PAC09
- [26] Fabrication and Characterization of Flexible Ultrathin Chip Package Using Photosensitive Polyimide [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (07): : 1099 - 1106
- [28] Embedded Niobium Using PI-2611 for Superconducting Flexible Cables [J]. MRS Advances, 2017, 2 (41) : 2199 - 2204