The Relation Between Degradation Under DC and RF Stress Conditions

被引:29
作者
Scholten, Andries J. [1 ]
Stephens, Daniel [1 ]
Smit, Geert D. J. [1 ]
Sasse, Guido T. [2 ]
Bisschop, Jaap [2 ]
机构
[1] NXP TSMC Res Ctr, NL-5656 AE Eindhoven, Netherlands
[2] NXP Semicond, Wafer Technol & Foundry Org, NL-6534 AE Nijmegen, Netherlands
关键词
Device reliability; hot-carrier degradation; negative-bias temperature instability (NBTI); radio-frequency complementary metal-oxide-semiconductor (RF CMOS); reliability; HOT-CARRIER DEGRADATION; INDUCED MOSFET DEGRADATION; RELIABILITY; AC; MODEL; NBTI;
D O I
10.1109/TED.2011.2153854
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we develop a method to derive degradation formulas for time-varying stress from the formulas for the constant-bias case, discuss its limitations, and apply it to a set of radio-frequency (RF) stress experiments. First, we will give a new derivation of the well-known power-law case without invoking any specific physical degradation model. Next, we will show that this derivation can be generalized to the broader class of degradation functions of type g(f(V-i) . t). We will illustrate our work with an example of hot-carrier degradation in 45-nm n-channel metal-oxide-semiconductor field-effect transistors, where an accurate prediction of the measured lifetime under RF stress conditions is obtained from the measured degradation under direct-current stress.
引用
收藏
页码:2721 / 2728
页数:8
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