Electrodeposition of amorphous gold alloy films

被引：15

作者：

Katoa, Masaru

Senda, Kazutaka

Musha, Yuta

Sasano, Junji

Okinaka, Yutaka

Osaka, Tetsuya ^{[1
]}

机构：

[1] Waseda Univ, Sch Sci & Engn, Dept Appl Chem, Tokyo 1698555, Japan

[2] Waseda Univ, Kagami Mem Lab Mat Sci & Technol, Tokyo 1690051, Japan

[3] Waseda Univ, Adv Res Inst Sci & Engn, Tokyo 1698555, Japan

来源：

ELECTROCHIMICA ACTA | 2007年 / 53卷 / 01期

关键词：

electroplating; amorphous gold-nickel alloy; amorphous gold-cobalt alloy; nickel-tungsten alloy; cobalt-tungsten alloy;

D O I：

10.1016/j.electacta.2007.01.045

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The process for electroplating amorphous gold-nickel-tungsten alloy that we developed previously based on the addition of a gold salt to a known amorphous Ni-W electroplating solution was investigated further using the X-ray diffraction (XRD) method for the purpose of quickly surveying the effects of various experimental variables on the microstructure of the alloy. In this system the gold concentration in the plating bath was found to be critical; i.e., when it is either very low or very high, the deposit becomes crystalline to XRD. The deposit composition varies linearly with the mole ratio of An to Ni in solution, and the alloy deposit is amorphous to XRD when the atomic ratio of Au/Ni in the deposit is between 0.5 and 1.5. At suitable concentrations of the metal ions, the deposit contains essentially no tungsten. By extending the work on the Au-Ni-W system, an amorphous Au-Co alloy plating process was also developed. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：11 / 15

页数：5