Research on MID Application in RFID Based on Intelligent Materials

被引：0
|
作者：
Xu, Wenjin [1 ]
机构：
[1] Qingdao Univ Sci & Technol, Qingdao 266101, Shandong, Peoples R China
来源：
ADVANCED RESEARCH ON MATERIAL ENGINEERING, CHEMISTRY AND BIOINFORMATICS, PTS 1 AND 2 (MECB 2011) | 2011年 / 282-283卷
关键词：
Molded Interconnect Devices; MID; IOT; RFID;
D O I：
10.4028/www.scientific.net/AMR.282-283.244
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (TOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.
引用
收藏
页码：244 / 247
页数：4
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