Strain relaxation near high-k/Si interface by post-deposition annealing

被引:10
作者
Emoto, T
Akimoto, K
Yoshida, Y
Ichimiya, A
Nabatame, T
Toriumi, A
机构
[1] Toyota Natl Coll Technol, Toyota, Aichi 4718525, Japan
[2] Nagoya Univ, Chikusa Ku, Nagoya, Aichi 4648603, Japan
[3] AIST, ASET, MIRAI, Tsukuba, Ibaraki 3058569, Japan
[4] ASRC, MIRAI, Tsukuba, Ibaraki 3058562, Japan
[5] ASRC, MIRAI, Tsukuba, Ibaraki 3058562, Japan
[6] Univ Tokyo, Bunkyo Ku, Tokyo 1138656, Japan
关键词
high-k; HfO2; strain; interfacial layer; post-deposition anneal;
D O I
10.1016/j.apsusc.2004.10.088
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We studied the effect of post-deposition annealing on a HfO2/Si interface of by extremely asymmetric X-ray diffraction. Comparing the rocking curves before annealing the sample with those of the annealed sample, it is found that an interfacial layer with a density of 3 g/cm(3) grows at the interface between the HfO2 layer and the substrate during post-deposition annealing. The wavelength dependency of the integrated intensities of the rocking curve for the as-deposited sample fluctuated with the observation position. This fluctuation was suppressed by annealing. From these results we concluded that the strain introduced into the substrate becomes homogeneous by annealing. Moreover, a quantitative estimation of the strain by curve fitting reveals the existence of compressive strain under the HfO2 layer. (c) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:55 / 60
页数:6
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