An Inductive-Coupling Link for 3-D Network-on-Chips

被引：0
|
作者：
Kadomoto, Junichiro [1 ]
Amano, Hideharu [1 ]
Kuroda, Tadahiro [1 ]
机构：
[1] Keio Univ, Fac Sci & Technol, Yokohama, Kanagawa, Japan
来源：
PROCEEDINGS INTERNATIONAL SOC DESIGN CONFERENCE 2017 (ISOCC 2017) | 2017年
关键词：
Network-on-chips (NoC); inductive-coupling link; 3-D integration;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.
引用
收藏
页码：150 / 151
页数：2
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