Three dimensional CMOS integrated circuits on large grain polysilicon films

被引：29

作者：

Chan, VWC ^{[1
]}

Chan, PCH ^{[1
]}

Chan, M ^{[1
]}

机构：

[1] Hong Kong Univ Sci & Technol, EEE, Hong Kong, Hong Kong, Peoples R China

来源：

INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST | 2000年

关键词：

D O I：

10.1109/IEDM.2000.904283

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we report high performance three-dimensional (3-D) CMOS integrated circuits. The first layer of transistors is fabricated on Silicon-on-Insulator (SOI) and second layer is fabricated on large-gain polysilicon-on-insulator (LPSOI) film, with oxide as the interlayer dielectric. The LPSOI film is formed by the re-crystallization of amorphous silicon through metal-induced lateral crystallization (MILC) at an elevated temperature. Compared with the conventional 2-D CMOS SOI low-voltage circuit, 3D circuit shows significant reduction in circuit area, shorter propagation delay and lower dynamic power consumption.

引用

页码：161 / 164

页数：4