Investigations of Au/Sn alloys on different end-metallizations for high temperature applications

被引：64

作者：

Anhock, S ^{[1
]}

Oppermann, H ^{[1
]}

Kallmayer, C ^{[1
]}

Aschenbrenner, R ^{[1
]}

Thomas, L ^{[1
]}

Reichl, H ^{[1
]}

机构：

[1] Tech Univ Berlin, Microperipher Ctr, D-13355 Berlin, Germany

来源：

TWENTY SECOND IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, IEMT-EUROPE 1998: ELECTRONICS MANUFACTURING AND DEVELOPMENT FOR AUTOMOTIVES | 1998年

关键词：

D O I：

10.1109/IEMTE.1998.723081

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Au/Sn solder is constantly becoming more important in the field of microelectronic packaging. Especially for high temperature and fluxless applications, for example in optoelectronics Au-Sn solder-bumps are used. The Au/Sn solders come in contact with different end-metallization systems such as nickel, platinum or palladium used as under bump-metallization. Information about the ternary systems Au-Ni-Sn, Au-Pd-Sn and Au-Pt-Sn as a metallurgical fundamentals are very important for understanding and controlling the technological processes. This knowledge is the base for investigations on reliability, phase formations, growth and stability, diffusion mechanisms and diffusion path ways. This paper summarizes the work done on different Au-Ni-Sn; Au-Pd-Sn- and Au-Pt-Sn-alloys with maximum 20 at.-% Ni, Pd and Pt contents and investigations on diffusion and interface reactions of Au-Sn-solders on Ni, Pd and Pt. Isothermal sections of the solid state are introduced. The presence of unknown Au-Ni-Sn- and Au-Pd-Sn-phases in the tie-triangle is discussed. Results of diffusion investigations and interface reactions are shown.

引用

页码：156 / 165

页数：10