Study of Power/Ground Plane Separation on Radiated Emission Suppression

被引：0
|
作者：
Soh, Wei-Shan [1 ]
Chang, Weng-Yew [2 ]
See, Kye-Yak [1 ]
Oswal, Manish [1 ]
Koh, Wee-Jin [2 ]
Low, Hazel [3 ]
机构：
[1] Nanyang Technol Univ, Sch EEE, Electromagnet Effects Res Lab, Singapore, Singapore
[2] DSO Natl Labs, Singapore 118230, Singapore
[3] Def Sci & Technol Agcy, Singapore 118226, Singapore
来源：
2010 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGE & SYSTEMS SYMPOSIUM | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In today's high-speed board design, decoupling using on-board capacitors are necessary to provide stable DC power and to suppress radiated emission from the board. At the higher frequency beyond 300 MHz, one has to rely on the capacitance offered by the power-ground plane pair in multi-layer stackup to provide effective decoupling. This paper provides an in-depth analysis on the suppression of board emission with the reduction of plane separation.
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页数：4
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