FinFET-based SRAM design

被引:95
作者
Guo, Z [1 ]
Balasubramanian, S [1 ]
Zlatanovici, R [1 ]
King, TJ [1 ]
Nikolic, B [1 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
来源
ISLPED '05: PROCEEDINGS OF THE 2005 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN | 2005年
关键词
memory; SRAM; low power; double gate transistors;
D O I
10.1109/LPE.2005.195476
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Intrinsic variations and challenging leakage control in today's bulk-Si MOSFETs limit the scaling of SRAM. Design tradeoffs in six-transistor (6-T) and four-transistor (4-T) SRAM cells are presented in this work. It is found that 6-T and 4-T FinFET-based SRAM cells designed with built-in feedback achieve significant improvements in the cell static noise margin (SNM) without area penalty. Up to 2x improvement in SNM can be achieved in 6-T FinFET-based SRAM cells. A 4-T FinFET-based SRAM cell with built-in feedback can achieve sub-100pA per-cell standby current and offer the similar improvements in SNM as the 6-T cell with feedback, making them attractive for low-power, low-voltage applications.
引用
收藏
页码:2 / 7
页数:6
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