A study to improve wafer productivity and quality in semiconductor slicing

Although improvements in wafering techniques have produced great saving in device manufacture, further advances in both wafer productivity and quality can be achieved by a systems approach to the slicing operation. This article discusses the advantages and limitations of the several basic types od I.D. slicing machines and the importance of every aspect of the slicing operation to achieving optimum results. The author discusses how improve productivity and quality can be achieved with existing technology..