Glob-top reliability characterization: Evaluation and analysis methods

被引：1

作者：

Doyle, R ^{[1
]}

O'Flynn, B ^{[1
]}

Lawton, W ^{[1
]}

Barrett, J ^{[1
]}

Buckley, J ^{[1
]}

机构：

[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1998年 / 21卷 / 02期

关键词：

encapsulant; failure analysis; glob-top; reliability;

D O I：

10.1109/95.705478

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.

引用

页码：292 / 300

页数：9