Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish

被引：39

作者：

Tsao, L. C. ^{[1
]}

Wu, M. W. ^{[2
]}

Chang, S. Y. ^{[3
]}

机构：

[1] Natl Pingtung Univ Sci & Technol, Dept Mat Engn, Neipu 91201, Pingtung, Taiwan

[2] Natl Formosa Univ, Dept Mat Sci & Engn, Huwei 632, Yunlin, Taiwan

[3] Natl Yunlin Univ Sci & Technol, Dept Mech Engn, Touliu 64002, Yunlin, Taiwan

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2012年 / 23卷 / 03期

关键词：

LEAD-FREE SOLDERS; MECHANICAL-PROPERTIES; JOINTS; GROWTH; SCALLOPS; LA;

D O I：

10.1007/s10854-011-0471-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study investigated the effects of TiO2 nanoparticles on the interfacial microstructures and bonding strength of Sn0.7Cu (SC) composite solder joints in ball grid array packages with immersion Sn surface finishes. The addition of TiO2 nanoparticles to SC solders resulted in significant changes in the interfacial microstructure. The nanoparticle addition suppressed the growth of the Cu6Sn5 IMC layer, significantly improving shear strength and reliability of solder joints after multiple reflows. The fracture surfaces of the SC solder exhibited a semi-brittle fracture mode with a relatively smooth surface, while those of the SC composite solder showed typical ductile failures with very refined dimpled surfaces.

引用

页码：681 / 687

页数：7

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