Modeling of irregular shaped power distribution planes using transmission matrix method

被引:103
作者
Kim, JH [1 ]
Swaminathan, M [1 ]
机构
[1] Georgia Inst Technol, Dept Elect & Comp Engn, Packaging Res Ctr, Atlanta, GA 30332 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2001年 / 24卷 / 03期
关键词
decoupling capacitor; power distribution system; simultaneous switching noise; transmission matrix method;
D O I
10.1109/6040.938301
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A major problem in power distribution networks is simultaneous switching noise (SSN), which causes several signal integrity issues. To understand the behavior of the power distribution system (PDS) and its contribution to SSN, noise prediction methods are necessary. This paper presents a method for analyzing arbitrary shaped power distribution networks both in the frequency and time domain. Using a two dimensional array of distributed RLCG circuits, the impedance of a power/ground plane pair is computed. For the efficient computation of the power distribution impedances at specific points in the network, a multi-input and multi-output transmission matrix method has been used. To verify the accuracy of this method, the simulation results have been compared with Spice which uses a circuit based approach and an analytical solution based on the cavity modes in the structure. The simulation results have also been compared with measurements for an L-shaped structure. The transmission matrix method has been applied to a split plane and an arbitrary shaped power plane to demonstrate the application of this technique to irregular geometries.
引用
收藏
页码:334 / 346
页数:13
相关论文
共 14 条
[1]   TRANSMISSION-LINE MATRIX-METHOD WITH IRREGULARLY GRADED SPACE [J].
ALMUKHTAR, DA ;
SITCH, JE .
IEE PROCEEDINGS-H MICROWAVES ANTENNAS AND PROPAGATION, 1981, 128 (06) :299-305
[2]  
[Anonymous], MICROELECTRONICS P 1
[3]   Model order reduction techniques applied to electromagnetic problems [J].
Cangellaris, AC ;
Ruehli, AE .
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, :239-242
[4]   Comparison of methods for modeling ALAN's power plane structure [J].
Chun, SJ ;
Kim, JH ;
Na, NJ ;
Swaminathan, M .
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, :247-250
[5]  
KIM J, 2001, P IEEE INT S EL COMP
[6]  
Kim JH, 2000, PROCEEDINGS OF US-KOREA WORKSHOP ON NEW FRONTIER IN INFRASTRUCTURAL/SEISMIC ENGINEERING, P83
[7]   MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES [J].
LEE, K ;
BARBER, A .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04) :628-639
[8]  
Na NJ, 2000, IEEE T ADV PACKAGING, V23, P340, DOI 10.1109/6040.861546
[9]   Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination [J].
Novak, I .
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1998, :181-184
[10]  
Okoshi T., 1984, PLANAR CIRCUITS MICR