A Temperature Control Method for Microaccelerometer Chips Based on Genetic Algorithm and Fuzzy PID Control

被引:15
作者
Chen, Jiaxiao [1 ]
Lu, Qianbo [2 ]
Bai, Jian [1 ]
Xu, Xiang [1 ]
Yao, Yuan [3 ]
Fang, Weidong [1 ]
机构
[1] Zhejiang Univ, State Key Lab Modern Opt Instrumentat, Hangzhou 310027, Peoples R China
[2] Northwestern Polytech Univ, Frontiers Sci Ctr Flexible Elect FSCFE, MIIT Key Lab Flexible Elect KLoFE,Ningbo Inst Nor, Shaanxi Key Lab Flexible Elect KLoFE,Inst Flexibl, Xian 710072, Peoples R China
[3] Wuhan Natl Lab Optoelect, Huazhong Inst ElectroOpt, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金;
关键词
accelerometers; temperature control; fuzzy logic; genetic algorithms; microelectromechanical devices; ACCELEROMETER; COMPENSATION; DRIFT;
D O I
10.3390/mi12121511
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
External temperature changes can detrimentally affect the properties of a microaccelerometer, especially for high-precision accelerometers. Temperature control is the fundamental method to reduce the thermal effect on microaccelerometer chips, although high-performance control has remained elusive using the conventional proportional-integral-derivative (PID) control method. This paper proposes a modified approach based on a genetic algorithm and fuzzy PID, which yields a profound improvement compared with the typical PID method. A sandwiched microaccelerometer chip with a measurement resistor and a heating resistor on the substrate serves as the hardware object, and the transfer function is identified by a self-built measurement system. The initial parameters of the modified PID are obtained through the genetic algorithm, whereas a fuzzy strategy is implemented to enable real-time adjustment. According to the simulation results, the proposed temperature control method has the advantages of a fast response, short settling time, small overshoot, small steady-state error, and strong robustness. It outperforms the normal PID method and previously reported counterparts. This design method as well as the approach can be of practical use and applied to chip-level package structures.
引用
收藏
页数:14
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