Hot embossing of micro and sub-micro structured inserts for polymer replication

被引:34
作者
Kolew, Alexander [1 ]
Muench, Daniel [1 ]
Sikora, Karsten [1 ]
Worgull, Matthias [1 ]
机构
[1] Karlsruhe Inst Technol, D-76128 Karlsruhe, Germany
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2011年 / 17卷 / 04期
关键词
Injection Molding; Mold Insert; Polymer Part; Metal Insert; Polymer Foil;
D O I
10.1007/s00542-010-1182-x
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Today replication of microstructured parts is state of the art in laboratory and commercial use. Beside the process of injection molding hot embossing enables the accurate replication of polymer structures in a broad variety of thermoplastic polymers even in the nanometer range. Characteristic for the most replication processes dealing with thermoplastic polymers is the use of microstructured mold inserts based on metals. In this paper we describe an alternative to the established mold inserts--the use of so called interstage mold inserts. These interstage mold inserts are replicated in high performance polymers and technical thermoplastics and can be fabricated many times by a previous replication step from a master even in the sub-micro range. Aspects like suitable material combinations, demolding behaviour, long time stability, production rate, and the quality of structures will be discussed. Because of the high flexibility the process of hot embossing is used for the fabrication of the microstructured interstage mold inserts and their replications.
引用
收藏
页码:609 / 618
页数:10
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