Ti-Ni-Cu/polyimide composite-film actuator and simulation tool

被引:17
|
作者
Ishida, Akira [1 ]
机构
[1] Natl Inst Mat Sci, Tsukuba, Ibaraki 3050047, Japan
关键词
Shape memory alloy; Thin film; Actuator; MEMS; Composite; Simulation; THIN-FILMS;
D O I
10.1016/j.sna.2014.12.012
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Polyimide/Ti49Ni33Cu18 composite films were fabricated by the sputtering of an alloy target. The composite films could be used as a simple actuator by cutting an appropriately shaped piece out of an as-sputtered films with scissors and then connecting it to a battery. In order to investigate the design parameters for the composite-film actuators, Ti-Ni-Cu films with various thicknesses (0.8-13 mu m) were deposited on two kinds of polyimide films (Kapton EN and H) with various thicknesses (25-175 mu m). The force and stroke of the composite-film actuators were found to vary largely with changes in various parameters such as the thickness ratio of Ti-Ni-Cu and polyimide films and the coefficient of thermal expansion of the polyimide films. A simulation tool based on a simple deformation model for a shape memory alloy was developed, and the effects of dimensional parameters (thickness, length, and width) and material parameters (Young's modulus, elastic strain limit, and transformation strain) on the actuation properties (force and stroke) of the composite-film actuators were systematically investigated on the basis of the simulation results. The simulation results revealed that composite-film actuators allow for various combination of force and stroke. Optimized actuators exhibited a long actuation stroke, a high response speed of 3 Hz, and a large force of 0.4 N. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:228 / 236
页数:9
相关论文
共 50 条
  • [1] Shape memory behavior of Ti-Ni-Cu thin films
    Ishida, A.
    Sato, M.
    Ogawa, K.
    Yamada, K.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 438 : 683 - 686
  • [2] Properties and applications of Ti-Ni-Cu shape-memory-alloy thin films
    Ishida, A.
    Sato, M.
    Gao, Z. Y.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 577 : S184 - S189
  • [3] Thermomechanical behavior and electric characteristic of Ti-Ni-Cu shape memory alloy
    Takeda, Y.
    Yamamoto, T.
    Goto, A.
    Sakuma, T.
    TRANSACTIONS OF THE MATERIALS RESEARCH SOCIETY OF JAPAN, VOL 32, NO 3, 2007, 32 (03): : 627 - 630
  • [4] Effect of Substrate Temperature on the Shape Memory Behavior of Ti-Ni-Cu Ternary Alloy Sputtered Films
    Inoue, S.
    Morino, K.
    Yoshiki, K.
    Namazu, T.
    THERMEC 2011, PTS 1-4, 2012, 706-709 : 1903 - 1908
  • [5] Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator
    Tomozawa, M.
    Kim, H. Y.
    Yamamoto, A.
    Hiromoto, S.
    Miyazaki, S.
    ACTA MATERIALIA, 2010, 58 (18) : 6064 - 6071
  • [6] Martensitic transformation in amorphous-crystalline Ti-Ni-Cu and Ti-Hf-Ni-Cu thin ribbons
    N. Resnina
    S. Belyaev
    A. Shelyakov
    The European Physical Journal Special Topics, 2008, 158 : 21 - 26
  • [7] Structure of martensite in sputter-deposited (Ni,Cu)-rich Ti-Ni-Cu thin films containing Ti(Ni,Cu)2 precipitates
    Meng, X. L.
    Sato, M.
    Ishida, A.
    ACTA MATERIALIA, 2009, 57 (05) : 1525 - 1535
  • [8] Effect of copper content on superelasticity characteristics in Ti-Ni and Ti-Ni-Cu alloy wires
    Sakuma, T
    Hosogi, M
    Okabe, N
    Iwata, U
    Okita, K
    MATERIALS TRANSACTIONS, 2002, 43 (05) : 828 - 833
  • [9] Martensitic transformation in amorphous-crystalline Ti-Ni-Cu and Ti-Hf-Ni-Cu thin ribbons
    Resnina, N.
    Belyaev, S.
    Shelyakov, A.
    EUROPEAN PHYSICAL JOURNAL-SPECIAL TOPICS, 2008, 158 (1) : 21 - 26
  • [10] The microstructure of Ti-Ni-Cu shape memory thin films: a review
    Li, Jun
    Feng, Xinxin
    Wang, Haizhen
    Meng, Xianglong
    Gao, Zhiyong
    Yi, Xiaoyang
    MATERIALS SCIENCE AND TECHNOLOGY, 2022, 38 (03) : 143 - 158