Phase change materials for thermal management of IC packages

被引：0
|
作者：
Behunek, Ivo [1 ]
Fiala, Pavel [1 ]
机构：
[1] Brno Univ Technol, Dept Theoret & Expt Elect Engn, Brno 61200, Czech Republic
来源：
RADIOENGINEERING | 2007年 / 16卷 / 02期
关键词：
phase change; FEM; heat; integrated circuit;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in ID which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
引用
收藏
页码：50 / 55
页数：6
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