Ultra-low temperature curable nano-silver conductive adhesive for piezoelectric composite material

Limited by the low thermal resistance of composite material, ultra-low temperature curable conductive silver adhesive with curing temperature less than 100 degrees C needed urgently for the surface conduction treatment of piezoelectric composite material. An ultra-low temperature curable nano-silver conductive adhesive with high adhesion strength for the applications of piezoelectric composite material was investigated. The crystal structure of cured adhesive, SEM/EDS analysis, thermal analysis, adhesive properties and conductive properties of different content of nano-silver filler or micron-silver doping samples were studied. The results show that with 60 wt.% nano-silver filler the ultra-low temperature curable conductive silver adhesive had the relatively good conductivity as volume resistivity of 2.37 x 10(-4) Omega cm, and good adhesion strength of 5.13 MPa. Minor micron-doping (below 15 wt.%) could improve conductivity, but would decrease other properties. The ultra-low temperature curable nano-silver conductive adhesive could successfully applied to piezoelectric composite material.