Bismaleimide/Phenolic/Epoxy Ternary Resin System for MoldingCompounds in High-Temperature Electronic Packaging Applications

Development of a new packaging material withsuperior high-temperature stability is becoming increasingly crucialin high-power and high-density electronics industry. In this study,we employed bis(3-ethyl-5-methyl-4-maleimidephenyl)methane(BMI),para-xylene phenolic resin (PF), and triphenylmethanenovolac epoxy resin (EP) as matrix resins to develop high-temperature-stable BPE ternary resin molding compounds forpower device packaging. BMI wasfirst melt-blended with PF toobtain the premix with a reduced softening point for meeting therequirement of melt-kneading process. 2-Ethyl-4-methylimidazolewith a dosage of 2 wt % of the ternary resins, could effectivelypromote the curing reaction, making the molding process of BPEmolding compounds be compatible with that of the existing epoxymolding compounds (EMC). The introduction of BMI componentcould enhance the chain rigidity and heat resistance of cured resins. When the BMI content was more than 70 wt % of the ternaryresins, the cured BPE molding compounds exhibited the glass transition temperature and initial decomposing temperature largerthan 250 and 400 degrees C, respectively, indicating a much superior thermal performance to that of the cured EMC. Moreover, theflexuralperformance and the adhesion strength with copper at 260 degrees C, high-temperature aging resistance, dielectric properties, and thermalconductivity of the cured BPE molding compounds were also improved compared with those of the cured EMC. This study providesa promising strategy for preparing heat-resistant electronic packaging molding compounds.