Uniformity optimization techniques for rapid thermal processing systems

被引:3
作者
Acharya, N [1 ]
Kirtikar, V
Shooshtarian, S
Doan, H
Timans, PJ
Balakrishnan, KS
Knutson, KL
机构
[1] Mattson Technol, San Jose, CA 95134 USA
[2] Steag RTP Syst Inc, San Jose, CA 95134 USA
[3] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA
[4] Intel Corp, Hillsboro, OR 97124 USA
关键词
optimization; rapid thermal processing; RTP; uniformity; wafer;
D O I
10.1109/66.939818
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents two efficient robust methods for uniformity optimization of rapid thermal processes. Both of these methods involve the reuse of empirical response surfaces linking zone powers to measured process data created on a baseline system. The first method uses fossilized gain matrices from the baseline system, while the second method involves customization of the baseline response surface for each system. The approaches use the response surfaces for iterative modification of zone powers to reduce the process nonuniformity on successively processed wafers. These methods are applied to the optimization of rapid thermal oxidation processes on several lamp-heated rapid thermal processing systems. Most of the uniformity improvement is obtained with the first two optimization runs; in some instances, the process is optimized to less than 1% 1-sigma nonuniformity with the use of just two wafers. Because the response surfaces from the baseline system can be reused for all similar systems, considerable savings in time and wafers are realized.
引用
收藏
页码:218 / 226
页数:9
相关论文
共 19 条
[1]  
ARAL G, 1994, 2 INT RAP THERM PROC, P288
[2]   Model-based control in rapid thermal processing [J].
Balakrishnan, KS ;
Edgar, TF .
THIN SOLID FILMS, 2000, 365 (02) :322-333
[3]  
Balakrishnan KS, 1999, ELEC SOC S, V99, P399
[4]  
BALAKRISHNAN KS, 1998, THESIS U TEXAS AUSTI
[5]  
BALAKRISHNAN KS, 1996, 4 INT C ADV THERM PR, P279
[6]  
ELIA CF, 1994, PROCEEDINGS OF THE 1994 AMERICAN CONTROL CONFERENCE, VOLS 1-3, P907
[7]   THE INTEGRATION OF SIMULATION AND RESPONSE-SURFACE METHODOLOGY FOR THE OPTIMIZATION OF IC PROCESSES [J].
GASTON, GJ ;
WALTON, AJ .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1994, 7 (01) :22-33
[8]  
GAT AS, 1987, Patent No. 4680451
[9]  
JENSEN KF, 1996, ADV RAPID THERMAL IN, pCH10
[10]  
KERSCH A, 1996, 4 INT C ADV THERM P, P347