Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

被引：59

作者：

Meng, Binbin ^{[1
,2
]}

Yuan, Dandan ^{[1
]}

Xu, Shaolin ^{[1
]}

机构：

[1] Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Peoples R China

[2] Wuhan Univ, Sch Power & Mech Engn, Wuhan 430000, Hubei, Peoples R China

来源：

CERAMICS INTERNATIONAL | 2019年 / 45卷 / 02期

关键词：

SiC; Coupling effect; Deformation; Molecular dynamics; MOLECULAR-DYNAMICS SIMULATION; DEFORMATION MECHANISM; NANOSCRATCH TESTS; SCRATCH; REGIME; MODEL; WEAR;

D O I：

10.1016/j.ceramint.2018.10.175

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this study, the influence mechanism of the coupling effect on the material removal process of SiC in nanoscale condition is investigated using the molecular dynamics method. The geometrical characteristics of a machined surface and the damage distribution under a coupling effect are analyzed. The influence law of the coupling effect on surface/subsurface features is also presented. According to the analysis results, the repeated and interference scratches with multi-abrasives, large-area machined surface morphology, and damage distribution are analyzed. This study is significant in understanding the removal mechanism of SiC during the grinding process at the nanoscale.

引用

页码：2483 / 2491

页数：9

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