Accelerated temperature cycle test and Coffin-Manson model for electronic packaging

被引：82

作者：

Cui, H ^{[1
]}

机构：

[1] RF Micro Devices, Greensboro, NC 27409 USA

来源：

ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2005 PROCEEDINGS | 2005年

关键词：

accelerated reliability testing; temperature cycle; Coffin-Manson model; activation energy;

D O I：

10.1109/RAMS.2005.1408421

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Temperature cycle profiles at various stress levels were investigated for accelerated reliability testing of electronic device packaging. Failure Analysis was conducted for test failures to determine their root cause failure mechanisms and failure modes. Weibull analysis was conducted for failures with the main failure mechanisms (such as solder fatigue, mechanical cracks). The Coffin-Manson model has been used to model crack growth due to repeated temperature cycling. A good correlation was obtained between the Coffin-Manson model and the test results, and Activation Energy (EA) was determined. The limitation and application of the Coffin-Manson model are further discussed. The main failure mechanism determined by failure analysis was Via Cracking in the package substrate. The acceleration factor between different stress levels was determined by Weibull analysis of test data. The Coffin-Manson model was used to correlate the test data and determine the activation energy related to via crack failure mechanism. The Coffin-Manson model with determined Activation Energy could be used to estimate product reliability under different application conditions for the same main failure mechanism.

引用

页码：556 / 560

页数：5