Factors Affecting the Cathode Edge Nodulation in Copper Electrorefining Process

被引:4
作者
Ahmadi, A. [1 ]
Sheibani, S. [1 ]
Mokmeli, M. [1 ]
Khorasani, S. M. J. [2 ]
Yaghoobi, N. S. [3 ]
机构
[1] Univ Tehran, Coll Engn, Sch Met & Mat Engn, Tehran, Iran
[2] Khatoonabad Copper Refinery, Proc Control Unit, Shahrebabak Copper Complex, Kerman, Iran
[3] Res & Dev Ctr, Shahrebabak Copper Complex, Kerman, Iran
来源
INTERNATIONAL JOURNAL OF ENGINEERING | 2022年 / 35卷 / 12期
关键词
Cathode Copper; Electrorefining; Nodule; Cathode Edge; Galvanostatic Test; ELECTROLYTE;
D O I
10.5829/ije.2022.35.12c.13
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study the factors that are affecting the copper nodular growth on the cathode edge were investigated from metallurgical and operation point of view. Statistical analysis was performed to evaluate the effect of operational conditions on the nodular copper growth by characterization of the nodule-containing cathodes. Besides, the effects of defects on polymer edge strips as well as changes in weight and thickness of anodes on the formation of nodules were investigated. Electrochemical galvanostatic experiments were employed to study the effect of electrolyte additives and the distance between the anode and cathode on cathode surface quality. A relatively large porosities of about 50 mu m were observed in the microstructure of the cathode edge nodules. In addition, few nodule samples that were taken was observed to have a higher concentration of Fe, Cd and Pb, up to 25 ppm. Low probability (1%) in the repeatability of the nodule formation over the same position on the edge strip was approved the insignificant effect of possible edge strip defects on nodulation. The large weight variation of anodes can cause the anode thickness variation by 10 mm and consequently alter the distance between the anode and the cathode. This was shown to cause formation of nodules at the cathode edge. The peaks that were observed in the cathodic potential curves in galvanostatic tests, were believed to be the sign of nodulation and therefore was investigated further using the optical microscopic images.
引用
收藏
页码:2370 / 2376
页数:7
相关论文
共 22 条
[1]   RAPID ELECTROCHEMICAL METHOD FOR MEASURING CONCENTRATION OF ACTIVE GLUE IN COPPER REFINERY ELECTROLYTE WHICH CONTAINS THIOUREA [J].
ANDERSEN, TN ;
BUDD, RD ;
STRACHAN, RW .
METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY, 1976, 7 (03) :333-338
[2]   NODULATION OF ELECTRODEPOSITED COPPER DUE TO SUSPENDED PARTICULATE [J].
ANDERSEN, TN ;
PITT, CH ;
LIVINGSTON, LS .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1983, 13 (04) :429-438
[3]   Short-Circuit Detection for Electrolytic Processes Employing Optibar Intercell Bars [J].
Aqueveque, Pablo E. ;
Wiechmann, Eduardo P. ;
Burgos, Rolando P. .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2009, 45 (04) :1225-1231
[4]  
Behagh A., 2015, IRAN J MATER SCI ENG, V12, P20, DOI DOI 10.22068/IJMSE.12.1.20
[5]  
Dutrizac JE, 1999, ELECTROREFINING AND ELECTROWINNING OF COPPER, P383
[6]   Modeling and Optimization of Charge Materials Ranges in Converter Furnace with Enhanced Passivation Time in Copper Electrorefining Process: A Mixture Design Approach [J].
Feizabad, M. H. Khazaei ;
Khayati, G. R. ;
Hernashki, R. Kafi ;
Khorasani, S. M. J. .
INTERNATIONAL JOURNAL OF ENGINEERING, 2021, 34 (04) :966-975
[7]  
Filzwieser I., 2005, THESIS MONTANUNIVERS
[8]  
Fischer H., 1973, Electrodeposition and Surface Treatment, V1, P239, DOI 10.1016/0300-9416(73)90017-5
[9]   ROLE OF THIOUREA IN THE ELECTRODEPOSITION OF COPPER [J].
KE, B ;
HOEKSTRA, JJ ;
SISON, BC ;
TRIVICH, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1959, 106 (05) :382-388
[10]   Galvanostatic and microscopic studies of nodulation during copper electrolysis [J].
Lafront, AM ;
Veilleux, B ;
Ghali, E .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2002, 32 (03) :329-337