A study on the thermal resistance over metal-carbon nanotube interface by molecular dynamics simulation

被引：6

作者：

Zhang, Da ^{[1
]}

Tang, Yuanzheng ^{[1
]}

Wang, Song ^{[1
]}

Lin, Han ^{[1
]}

He, Yan ^{[1
]}

机构：

[1] Qingdao Univ Sci & Technol, Coll Electromech Engn, Shandong Engn Lab Preparat & Applicat Highperform, Qingdao 266061, Peoples R China

来源：

COMPOSITE INTERFACES | 2022年 / 29卷 / 08期

基金：

中国国家自然科学基金;

关键词：

Molecular dynamics simulation; metal-carbon nanotube interface; interfacial thermal resistance; vibrational density of states (VDOS); HEAT-CONDUCTION; CNT; EVAPORATION; TRANSPORT;

D O I：

10.1080/09276440.2021.2024114

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

The interfacial thermal resistance between adjacent parts is important in the thermal management of micro/nano-scale systems. In this paper, the temperature difference and heat flow methods are adopted to study the interfacial thermal resistance between the smooth surface of metal and the end of carbon nanotube (CNT) by molecular dynamics simulation. The effects of metal type, CNT diameter, and mean interfacial temperature on the interfacial thermal resistance are studied in detail, with the temperature and heat flow conditions applied to the two metal atom groups of a dumbbell-shaped metal-CNT-metal model. For a certain metal type, the diameter and temperature dependences of the interfacial thermal resistance obtained from both the temperature difference and heat flow methods are consistent, the interfacial thermal resistance decreases with increase of CNT diameter exponentially, and the thermal rectification occurs due to different interfacial temperatures. The thermal transfer mechanism at the metal-CNT interface is quantitatively analyzed by calculating the overlap area of the normalized vibrational density of states. The results of this paper will provide in-depth theoretical insights into the heat transfer enhancement at nano-scale interface.

引用

页码：899 / 913

页数：15

共 38 条

[1]

Allen M. P., 1991, COMPUTER SIMULATION

[2] Enhancement of heat conduction in carbon nanotubes filled with fullerene molecules [J].

Cui, Liu ;

Feng, Yanhui ;

Zhang, Xinxin .

PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2015, 17 (41) :27520-27526

[3] Molecular dynamics simulations of carbon nanotube/silicon interfacial thermal conductance [J].

Diao, Jiankuai ;

Srivastava, Deepak ;

Menon, Madhu .

JOURNAL OF CHEMICAL PHYSICS, 2008, 128 (16)

[4] Inter-tube thermal conductance in carbon nanotubes arrays and bundles: Effects of contact area and pressure [J].

Evans, William J. ;

Shen, Meng ;

Keblinski, Pawel .

APPLIED PHYSICS LETTERS, 2012, 100 (26)

[5] Effect of nanopatterns on Kapitza resistance at a water-gold interface during boiling: A molecular dynamics study [J].

Hu, Han ;

Sun, Ying .

JOURNAL OF APPLIED PHYSICS, 2012, 112 (05)

[6] Heat transfer and superfluidity of helium II [J].

Kapitza, PL .

PHYSICAL REVIEW, 1941, 60 (04) :354-355

[7] Thermal Boundary Resistances of Carbon Nanotubes in Contact with Metals and Polymers [J].

Li, Qingwei ;

Liu, Changhong ;

Fan, Shoushan .

NANO LETTERS, 2009, 9 (11) :3805-3809

[8] Measuring the thermal conductivity of individual carbon nanotubes by the Raman shift method [J].

Li, Qingwei ;

Liu, Changhong ;

Wang, Xueshen ;

Fan, Shoushan .

NANOTECHNOLOGY, 2009, 20 (14)

[9] Reducing interfacial thermal resistance between metal and dielectric materials by a metal interlayer [J].

Li, Xiangyu ;

Park, Wonjun ;

Wang, Yan ;

Chen, Yong P. ;

Ruan, Xiulin .

JOURNAL OF APPLIED PHYSICS, 2019, 125 (04)

[10] Interface structure influence on thermal resistance across double-layered nanofilms [J].

Liang, XG ;

Sun, L .

MICROSCALE THERMOPHYSICAL ENGINEERING, 2005, 9 (03) :295-304

← 1 2 3 4 →