Hot embossing - a flexible and successful replication technology for polymer MEMS

被引:6
|
作者
Heckele, M [1 ]
机构
[1] Forschungszentrum Karlsruhe, Inst Mikrostrukturtech, D-76021 Karlsruhe, Germany
来源
MICROFLUIDICS, BIOMEMS, AND MEDICAL MICROSYSTEMS II | 2004年 / 5345卷
关键词
D O I
10.1117/12.537197
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molding of micro components from thermoplastic polymers has become a routinely used industrial production process. Besides the famous injection molding technology hot embossing is nearly unknown to most people in micro technology. Initially developed for first feasibility tests with microstructured moldinserts hot embossing has been developed during the last ten years to a flexible and successful replication technology for polymer MEMS: Material screening, rapid prototyping but even small series with far more then 10.000 components has lead to a first commercialization of the related machinery. But also high end applications, difficult to realize with other technologies, are requested to replicate complex microstructures. This paper gives an overview about the development of this technique and presents some new developments.
引用
收藏
页码:108 / 117
页数:10
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