Co-effect of heat and direct current on growth of intermetallic layers at the interface of Ti-Ni diffusion couples

被引:40
作者
Zhou, Y. [1 ]
Wang, Q. [1 ]
Sun, D. L. [1 ]
Han, X. L. [1 ]
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 10001, Peoples R China
关键词
Intermetallics; Diffusion; Kinetics; Microstructure; ELECTRIC-CURRENT; ELECTROMIGRATION; MICROSTRUCTURE; COMPOSITES;
D O I
10.1016/j.jallcom.2010.09.182
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The growth of the intermetallic layers at the interface of Ti-Ni diffusion couples was investigated under the co-effect of heat and direct current Isothermal diffusion treatments for Ti-Ni couples were conducted at 500 600 and 700 degrees C for 5 10 and 15 h with and without the passage of DC current of 10A Intensity It was found that both Ti2Ni and TiNi3 layer form at the Ti-Ni interface in all couples treated by different process but TiNi layer forms in the couples annealed above 600 C without current or at 500 C with current The growth of the whole interfacial layer shoots a parabolic relationship with time The apparent activation energy of growth for the whole interfacial layer is 83 76 kJ/mol in the couple treated by heating without a current and it decreases to 42 11 kJ/mol in the couple treated with a direct current of 10A during heating The effect of the current on the growth of different intermetallic layers vanes with its direction (C) 2010 Elsevier B V All rights reserved
引用
收藏
页码:1201 / 1205
页数:5
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