Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes

被引：9
作者：
Shang, Min [2 ]
Dong, Chong [2 ]
Yao, Jinye [2 ]
Wang, Chen [2 ]
Ma, Haoran [1 ]
Ma, Haitao [2 ]
Wang, Yunpeng [2 ]
机构：
[1] Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China
[2] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2021年 / 32卷 / 18期
基金：
中国国家自然科学基金;
关键词：
SOLDER; ENERGY; ALLOY; TIME;
D O I：
10.1007/s10854-021-06711-x
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The competitive growth of Cu3Sn and Cu6Sn5 in the multi-reflow processes induced by temperature, time, and cooling rate was systematically studied in this work. Results indicated that the thickness proportion of Cu3Sn in the IMC layer was highly promoted in the temperature-increased multi-reflow process and slightly increased with a fluctuation in the isothermal multi-reflow process, while obviously decreased in the temperature-decreased multi-reflow process. The proportion of Cu3Sn grew following the increase of reflow temperature, time, and cooling rate and the thickness of Cu3Sn formed at the central of the Cu6Sn5 bottom was higher than that formed at the edge. The results have a significant meaning in understanding and controlling the competitive growth of Cu3Sn and Cu6Sn5 and improving the reliability of solder joints.
引用
收藏
页码：22771 / 22779
页数：9
相关论文
共 18 条
  • [1] Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
    Choi, WK
    Lee, HM
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) : 1207 - 1213
  • [2] Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints
    Deng, X
    Piotrowski, G
    Williams, JJ
    Chawla, N
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (12) : 1403 - 1413
  • [3] Pb-free solders for flip-chip interconnects
    Frear, DR
    Jang, JW
    Lin, JK
    Zhang, C
    [J]. JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06): : 28 - +
  • [4] Lead-free reflow soldering for electronics assembly
    Harrison, MR
    Vincent, JH
    Steen, HAH
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (03) : 21 - 38
  • [5] The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
    Huang, Y. S.
    Hsiao, H. Y.
    Chen, Chih
    Tu, K. N.
    [J]. SCRIPTA MATERIALIA, 2012, 66 (10) : 741 - 744
  • [6] Grain size-dependent diffusion activation energy in nanomaterials
    Jiang, Q
    Zhang, SH
    Li, JC
    [J]. SOLID STATE COMMUNICATIONS, 2004, 130 (09) : 581 - 584
  • [7] Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
    Kim, HK
    Tu, KN
    [J]. PHYSICAL REVIEW B, 1996, 53 (23): : 16027 - 16034
  • [8] Lea C, 2010, QUAL RELIAB ENG INT, V5, P182
  • [9] Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
    Lee, Tae-Kyu
    Zhou, Bite
    Blair, Lauren
    Liu, Kuo-Chuan
    Bieler, Thomas R.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (12) : 2588 - 2597
  • [10] Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
    Liu, CM
    Ho, CE
    Chen, WT
    Kao, CR
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1152 - 1156
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