High Optical Transparency and Low Dielectric Constant Polyimides Containing Trifluoromethyl and Cyclohexane Groups

被引:13
作者
Mo, Xin [1 ,2 ]
Wang, Chen-Yi [3 ]
Li, Guang [1 ,2 ]
Jiang, Jian-Ming [1 ,2 ]
机构
[1] Donghua Univ, Coll Mat Sci & Engn, Shanghai 201620, Peoples R China
[2] State Key Lab Modificat Chem Fibers & Polymer Mat, Shanghai, Peoples R China
[3] Changzhou Univ, Sch Mat Sci & Engn, Changzhou, Peoples R China
来源
JOURNAL OF MACROMOLECULAR SCIENCE PART B-PHYSICS | 2012年 / 51卷 / 07期
关键词
dielectric property; optical transparency; polyimide; solubility; AROMATIC BIS(ETHER AMINE)S; POLY(ETHER IMIDE)S; SOLUBLE POLYIMIDES; DIANHYDRIDE; POLYMERIZATION; DIAMINE;
D O I
10.1080/00222348.2011.629903
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A series of novel polyimides (PIs) were polymerized from 4,4'-(cyclohexane-1,4-diylbis(oxy))bis(3-(trifluoromethyl)aniline) (1) and 1,4-bis((4-amino-2-(trifluoromethyl)phenoxy)methyl)cyclohexane (2), with two aromatic tetracarboxylic dianhydrides using the typical one-step method. The inherent viscosity of these resulting PIs were in the range of 0.53-0.91 dl/g in N,N-dimethylacetamide (DMAc) at 30 degrees C. They were readily soluble in numerous solvents, such as N-methyl-2-pyrrolidone (NMP), DMAc, N,N-dimethylformamide (DMF), meta-cresol (m-Cresol), and dimethylsulfoxide (DMSO). The PI films showed high optical transparency and were colorless with an ultraviolet-visible absorption cut-off wavelength around 330 nm, and a low dielectric constants of 2.49-2.93 at 1 MHz. The PIs also showed good thermal properties. Their glass-transition temperatures (T-g) were higher than 337 degrees C, and the temperatures of 10% weight loss in air and nitrogen were higher than 412 degrees C and 417 degrees C. Furthermore, the PI films possessed good mechanical properties with tensile strengths of 54-71 MPa, elongations at break of 11.6%-17.3% and low moisture absorption (<1.34%). Due to their properties, these PIs could be considered as materials for photoelectric and micro-electronic applications.
引用
收藏
页码:1370 / 1383
页数:14
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