Formation of Tensilely Strained Germanium-on-Insulator

被引:25
作者
Hoshi, Yusuke [1 ]
Sawano, Kentarou [1 ]
Hamaya, Kohei [2 ,3 ]
Miyao, Masanobu [2 ]
Shiraki, Yasuhiro [1 ]
机构
[1] Tokyo City Univ, Adv Res Lab, Res Ctr Silicon Nanosci, Setagaya Ku, Tokyo 1580082, Japan
[2] Kyushu Univ, Dept Elect, Fukuoka 8190395, Japan
[3] Japan Sci & Technol Agcy, PRESTO, Chiyoda Ku, Tokyo 1020075, Japan
关键词
GE; SI; MOBILITY; GROWTH;
D O I
10.1143/APEX.5.015701
中图分类号
O59 [应用物理学];
学科分类号
摘要
We fabricate a high-quality germanium-on-insulator (GOI) with tensile strain by combining the wafer bonding of a strained Ge grown on a Si substrate and an oxidized Si substrate and the selective etching of Si. The obtained 300-nm-thick strained GOI shows a smooth surface with RMS roughness of 0.15 nm and no dislocation is detected by cross-sectional transmission electron microscopy (XTEM). The tensile strain of 0.19% induced in the GOI is found to be maintained throughout the fabrication process. This suggests that the fabricated strained GOI has a high potential as an essential platform for high-performance electronic and optical devices. (C) 2012 The Japan Society of Applied Physics
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页数:3
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