共 18 条
[1]
Chou TKA, 2001, TRANSDUCERS '01: EUROSENSORS XV, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P1570
[2]
DECOSTER J, 2005, P IMPAS EMPC 2005 BR
[3]
From zero- to second-level packaging of RF-MEMS devices
[J].
MEMS 2005 MIAMI: TECHNICAL DIGEST,
2005,
:36-39
[4]
Jourdain A, 2003, DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003, P239
[5]
Jourdain A, 2003, BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P1915
[6]
Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices
[J].
FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST,
2002,
:677-680
[7]
JOURDAIN A, 2005, P IMPAS EMPC 2005 BR
[8]
Use of BCB in high frequency MCM interconnects
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1996, 19 (01)
:42-47
[9]
*MIL STAND, 1996, MILSTD883
[10]
MIN B, 2004, P EUR MICR C AMST NE, P1289