Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

被引：22

作者：

Choi, Hyelim ^{[1
]}

Lee, Tae-Kyu ^{[2
]}

Kim, Yunsung ^{[1
]}

Kwon, Hoon ^{[1
]}

Tseng, Chien-Fu ^{[3
]}

Duh, Jenq-Gong ^{[3
]}

Choe, Heeman ^{[1
]}

机构：

[1] 861 1 Kookmin Univ, Sch Adv Mat Engn, Seoul 136702, South Korea

[2] Cisco Syst, MTG, San Jose, CA 95134 USA

[3] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu 30013, Taiwan

来源：

INTERMETALLICS | 2012年 / 20卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

Ternary alloy systems; Alloy design; Microalloying; Grain growth; Trace element analysis; LEAD-FREE SOLDER; INTERFACIAL REACTIONS; SURFACE FINISH; SNAGCU SOLDER; SHEAR TEST; DROP TEST; RELIABILITY; TEMPERATURE; GROWTH; NI3AL;

D O I：

10.1016/j.intermet.2011.09.008

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The mechanical properties of new lead-free Sn-Ag-Cu solder alloys containing 0.05-0.1 wt.% boron were investigated under a range of isothermal aging and reflow conditions. The boron-doped solder joints showed higher ball pull strength than the baseline Sn-1.0Ag-0.5Cu solder joint under all isothermal aging and reflow conditions examined. In particular, the high-speed ball pull strength of the 0.05 wt.% B-doped solder joint was approximately 2.5 times greater than that of the baseline Sn-1.0Ag-0.5Cu solder joint aged at 150 degrees C for 200 h, which is attributed mainly to the reduced rate of grain growth in the intermetallic compound (IMC) layers of B-doped solder joints under aging conditions. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：155 / 159

页数：5

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