Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites

被引：121

作者：

Shen, Xiao-Yu ^{[1
]}

He, Xin-Bo ^{[1
]}

Ren, Shu-Bin ^{[1
]}

Zhang, Hao-Ming ^{[1
]}

Qu, Xuan-Hui ^{[1
,2
]}

机构：

[1] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China

[2] Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2012年 / 529卷

基金：

中国国家自然科学基金;

关键词：

Composite materials; Liquid-solid reactions; Heat conduction; Microstructure; HEAT SINK APPLICATIONS; POWDER-METALLURGY; CU COMPOSITES; CU/DIAMOND COMPOSITES; MICROSTRUCTURE; MANAGEMENT; CR;

D O I：

10.1016/j.jallcom.2012.03.045

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

As a carbide forming additive, molybdenum gets maximum benefit of high thermal conductivities of diamond and copper. Coating Mo on the diamond surface can promote the interfacial bonding in diamond/Cu composites. A Mo coated diamond/Cu composite with high thermal conductivity of 726 W/mK is obtained, which is achieved by a thin nano-sized Mo2C layer. Mo coated diamond or un-coated diamond reinforced copper composites have been made by pressure assisted liquid copper infiltration method. The interfacial configuration, the bulk thermal conductivity and the evolution of interfacial thermal resistance are presented, indicating that the good adhesion at the interface can decrease the thermal boundary resistance and thus increase the thermal conductivity of the composites. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：134 / 139

页数：6

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