Thermal fatigue properties and grain boundary character distribution in Sn-xAg-0.5Cu (x=1, 1.2 and 3) lead free solder interconnects

被引：19

作者：

Terashima, S. ^{[1
]}

Tanaka, M. ^{[1
]}

Tatsumi, K. ^{[1
]}

机构：

[1] Nippon Steel Corp Ltd, Adv Technol Res Labs, Futtsu, Chiba Pref 2938511, Japan

来源：

SCIENCE AND TECHNOLOGY OF WELDING AND JOINING | 2008年 / 13卷 / 01期

关键词：

lead free solder; Sn-Ag-Cu; thermal fatigue; grain boundary character distribution; orientation imaging microscopy;

D O I：

10.1179/174329308X271788

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal fatigue properties of Sn-xAg-0.5Cu (x51,1.2 and 3, mass%) lead free solder interconnects were discussed from the viewpoints of both morphology and grain boundary character distribution. 3Ag showed the longer thermal fatigue life than 1Ag and 1.2Ag. Both cracks, which were initiated by thermal strain, and grain boundary damage due to grain boundary sliding degraded the thermal fatigue lives. From a microstructural observation using orientation imaging microscopy, recrystallisation of tin grains was observed, and 3Ag suppressed coarsening of tin grains after further thermal fatigue as compared with 1Ag and 1.2Ag. Moreover, 3Ag showed a larger amount of coincidence site lattice boundaries than 1Ag and 1.2Ag. It is suggested that in 3Ag not only smaller tin grains but also larger amount of coincidence site lattice boundaries suppressed crack propagation and grain boundary sliding.

引用

页码：60 / 65

页数：6

共 27 条

[1]

BHADESHIA HKD, 2001, BAINITE STEELS, P260

[2] Pb-free solder:: New materials considerations for microelectronics processing [J].

Borgesen, Peter ;

Bieler, Thomas ;

Lehman, L. P. ;

Cotts, E. J. .

MRS BULLETIN, 2007, 32 (04) :360-365

[3] The mechanical behavior of interconnect materials for electronic packaging [J].

Frear, DR .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1996, 48 (05) :49-53

[4] The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue [J].

Henderson, DW ;

Woods, JJ ;

Gosselin, TA ;

Bartelo, J ;

King, DE ;

Korhonen, TM ;

Korhonen, MA ;

Lehman, LP ;

Kang, SK ;

Lauro, P ;

Shih, DY ;

Goldsmith, C ;

Puttlitz, KJ .

JOURNAL OF MATERIALS RESEARCH, 2004, 19 (06) :1608-1612

[5] Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects [J].

Kariya, Y ;

Hosoi, T ;

Terashima, S ;

Tanaka, M ;

Otsuka, M .

JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) :321-328

[6] Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders [J].

Lauro, P ;

Kang, SK ;

Choi, WK ;

Shih, DY .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (12) :1432-1440

[7] Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy [J].

Matin, MA ;

Coenen, EWC ;

Vellinga, WP ;

Geers, MGD .

SCRIPTA MATERIALIA, 2005, 53 (08) :927-932

[8] Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections [J].

Mattila, TT ;

Vuorinen, V ;

Kivilahti, JK .

JOURNAL OF MATERIALS RESEARCH, 2004, 19 (11) :3214-3223

[9] Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders [J].

Mavoori, H ;

Chin, J ;

Vaynman, S ;

Moran, B ;

Keer, L ;

Fine, M .

JOURNAL OF ELECTRONIC MATERIALS, 1997, 26 (07) :783-790

[10] A VIABLE TIN-LEAD SOLDER SUBSTITUTE - SN-AG-CU [J].

MILLER, CM ;

ANDERSON, IE ;

SMITH, JF .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :595-601

← 1 2 3 →