Preparation of Ag-Cu/Ni/Ag-Cu clad tapes for YBCO superconducting tape and its textured properties

被引：10
|
作者：
Yoshino, H [1 ]
Yamazaki, A [1 ]
Thanh, TD [1 ]
Kudo, Y [1 ]
Kubota, H [1 ]
机构：
[1] Toshiba Co Ltd, R&D Ctr, Adv Mat & Devices Lab, Saiwai Ku, Kawasaki, Kanagawa 2108582, Japan
来源：
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | 2001年 / 357卷
关键词：
superconducting tape; Ag clad tape; textured structure; proof stress;
D O I：
10.1016/S0921-4534(01)00444-0
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The Ag clad tape consisting of Ag-0.1%Cu and some Ni alloys was prepared. The textured property, the proof stress at high temperature and the superconductivity of YBa2Cu3 (YBCO) film deposited by PLD were studied. The uniform clad tape with a length of 10 m and a thickness of 0.1 nun was obtained and it showed the textured structure of (210)(120) after annealing at 700 degreesC. YBCO filmdeposited on the textured clad tape was aligned in-plane. From two to four times higher proof stress sigma (0.2) at 700 degreesC than that of Ag was obtained by cladding. High J(c) value of about 10(5) A/cm(2) was obtained on Ag-0.1%Cu/Ag-10%Ni clad tape. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码：923 / 930
页数：8
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