Multimode High-Density Link Design Methodology and Implementation

被引:4
作者
Yan, Zhuo [1 ]
Aygun, Kemal [2 ]
Braunisch, Henning [2 ]
Franzon, Paul D. [3 ]
机构
[1] Hewlett Packard Enterprise, Fremont, CA 94538 USA
[2] Intel Corp, Chandler, AZ 85226 USA
[3] North Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 08期
关键词
Codesign methodology; crosstalk mitigation; high-density links; modal signaling; multimode signaling; S-parameters; CROSSTALK; CANCELLATION;
D O I
10.1109/TCPMT.2016.2585498
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
As higher density of interconnects and packages is demanded, crosstalk noise is becoming more important. Multimode or modal signaling offers the ability to improve wiring density with significantly reduced crosstalk by coding the signals using fundamental modes of propagation only. Past work has demonstrated this on uniform channels. This paper presents a design methodology for designing practical nonuniform high density links using multimode signaling. A channel that consists of printed circuit board (PCB) and package routing, and vertical interconnects is designed to achieve highest density and low crosstalk-induced jitter. Compared to the baseline benchmark channel, the optimized channel demonstrates 4x, 4x, and 2x density improvement of PCB and package vertical and package horizontal routing, respectively, and at the same time achieves a 42% RMS jitter reduction. This new approach significantly improves the ability to design high-density low-crosstalk interconnect subsystems in practical scenarios.
引用
收藏
页码:1251 / 1260
页数:10
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