Introduction to the Summer 2022 Issue

被引:0
|
作者
Siegel, Peter H. [1 ,2 ,3 ]
机构
[1] THz Global, La Canada Flintridge, CA 91011 USA
[2] CALTECH, Dept Elect Engn, Pasadena, CA 91125 USA
[3] NASA Jet Prop Lab, Pasadena, CA 91109 USA
来源
IEEE JOURNAL OF MICROWAVES | 2022年 / 2卷 / 03期
关键词
Editorial board; journal of microwaves; opening editorial; author portal; summer issue;
D O I
10.1109/JMW.2022.3180304
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Welcome to our July 2022 issue of IEEE JOURNAL OF MICROWAVES. This month we are back to our regular plus invited manuscript queue (our last issue contained only unsolicited papers). We are especially excited this month to bring you one of our special Microwave Pioneer series pieces highlighting the career and contributions of our current IEEE President, K. J. Ray Liu, with an emphasis on microwave time-reversal focusing and tracking. This is accompanied by three invited papers covering topics on microwave applications for high-Tc superconducting devices and circuits, oscillators with non-linear gain, and beamforming with metasurfaces. Our remaining regular manuscript contributions continue to provide broad outreach and significant advances in several areas. Of particular note are articles on high-gain beamforming with a scanning lens array, a MIMO radar formed from a sparse array, a holographic RFID SDMA system, several unusual filter papers, and a detailed analysis of an animal chamber for RF exposure studies. Our monthly submission and download count has remained steady and continues to bode well for our ultimate inclusion in non-IEEE databases. As ofMay 2022, we have received over 340 manuscripts and have an enviable usage per published article rate of 1023, putting us third out of over 272 established IEEE publications for this statistic! We are also anticipating a large pool of popular articles for our 70(th) Anniversary of the MTT Society special issue, which comes out in January 2023. In July, we will be introducing a special "Author Portal" that should significantly improve our author submission experience. Please continue to enjoy our new publication and consider submitting your latest research!
引用
收藏
页码:350 / 359
页数:10
相关论文
共 22 条
  • [1] Introduction to the Summer 2021 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2021, 1 (03): : 670 - 678
  • [2] Introduction to the Spring 2022 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2022, 2 (02): : 230 - 238
  • [3] Introduction to the Fall 2022 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2022, 2 (04): : 535 - 544
  • [4] Introduction to the Winter 2022 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2022, 2 (01): : 3 - 12
  • [5] Introduction to the Summer 2024 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2024, 4 (03): : 307 - 317
  • [6] Introduction to the Summer 2023 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2023, 3 (03): : 854 - 862
  • [7] Introduction to the Spring 2021 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2021, 1 (02): : 515 - 522
  • [8] Introduction to the Autumn 2021 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2021, 1 (04): : 829 - 837
  • [9] Introduction to the Winter 2023 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2023, 3 (01): : 4 - 15
  • [10] Introduction to the January 2025 Issue
    Siegel, Peter H.
    IEEE JOURNAL OF MICROWAVES, 2025, 5 (01): : 3 - 13