Efficient simulation of transmission lines with EBG ground planes

被引:0
|
作者
Ho, JCW [1 ]
Roseanu, TS [1 ]
Abhari, R [1 ]
Khazaka, R [1 ]
机构
[1] McGill Univ, Dept Elect & Comp Engn, Montreal, PQ H3A 2A7, Canada
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The recent emergence of electromagnetic band-gap structures in state-of-the-art circuit design emphasizes the need for accurate and efficient analysis of such structures. In this paper, a framework for efficient simulation of these structures is shown, which includes a lumped element frequency-dependent model as well as suitable simulation algorithms. The performance and accuracy of the simulations are compared with a commercial simulation engine and a number of test cases are studied
引用
收藏
页码:57 / 60
页数:4
相关论文
共 50 条
  • [1] Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines
    Roy, Sourajeet
    Dounavis, Anestis
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 761 - 771
  • [2] Design and analysis of microstrip lines with EBG-backed ground planes of different geometrical shapes
    Menon, SK
    Vasudevan, K
    Aanandan, CK
    Mohanan, P
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2005, 46 (06) : 544 - 546
  • [3] Predictive Method for Efficient Transmission Lines and Multilayered Power/Ground Planes Co-Modeling Using Multi-Conductor Transmission Lines
    Bouchaala, Afef
    Courau, Lionel
    Galy, Philippe
    Bonnaud, Olivier
    2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 577 - 581
  • [4] Efficient simulation of Power/Ground planes for SiP applications
    Bharath, Krishna
    Engin, Ege
    Swaminathan, Madhavan
    Uriu, Kazuhide
    Yamada, Tom
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1199 - +
  • [5] Propagation impedance of transmission lines on perforated ground planes for multichip packages
    Cabon, B.
    Chilo, J.
    International Journal of Microcircuits and Electronic Packaging, 1993, 16 (01): : 49 - 59
  • [6] Two novel transmission lines with vertical conductors added to ground planes
    Duyar, Mehmet
    Akan, Volkan
    Yazgan, Erdem
    Bayrak, Mehmet
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2007, 49 (07) : 1653 - 1656
  • [7] Efficient transient simulation of transmission lines
    Condon, M
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 2065 - 2068
  • [8] Efficient Method for Predictive Package Power/Ground Planes Modeling Using Multi-Conductor Transmission Lines
    Bouchaala, Afef
    Couraui, Lionel
    Galy, Philippe
    Bonnaud, Olivier
    2015 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2015, : 113 - 116
  • [9] The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes
    Shih, Cheng-Hung
    Shiue, Guang-Hwa
    Wu, Tzong-Lin
    Wu, Ruey-Beei
    2008 ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 19TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, 2008, : 164 - +
  • [10] Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams
    Ho, JCW
    Zhu, QY
    Abhari, R
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2004, : 195 - 198