Two-dimensional low-coherence interferometry for the characterization of nanometer-wafer-topographies

被引:5
作者
Taudt, Ch. [1 ,2 ,3 ]
Baselt, T. [1 ,3 ,4 ]
Nelsen, B. [1 ]
Assmann, H. [5 ]
Greiner, A. [5 ]
Koch, E. [2 ]
Hartmann, P. [1 ,3 ]
机构
[1] Univ Appl Sci Zwickau, Dr Friedrichs Ring 2a, Zwickau, Germany
[2] Tech Univ Dresden, Med Fak Carl Gustav Carus, Dresden, Germany
[3] Fraunhofer Inst Werkstoff & Strahltech IWS, Dresden, Germany
[4] Tech Univ Dresden, Fak Maschinenwesen, Dresden, Germany
[5] Infineon Technol Dresden GmbH, Dresden, Germany
来源
OPTICAL MICRO- AND NANOMETROLOGY VI | 2016年 / 9890卷
关键词
optical metrology; interferometric measurement; dispersion based measurements; in-line characterization; low-coherence interferometry; surface profilometry; SURFACE-MORPHOLOGY; SCATTEROMETRY; MICROSCOPY;
D O I
10.1117/12.2227887
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Within this work a scan-free, low-coherence interferometry approach for surface pro fi lometry with n m-precision is presented. The basic setup consist of a M i c h e l s o n-type interferometer which is powered by a supercontinuum light-source (Delta lambda = 400 - 1700 n m). The introduction of an element with known dispersion delivers a controlled phase variation which can be detected in the spectral domain and used to reconstruct height di ff erences on a sample. In order to enable scan-free measurements, the interference signal is spectrally decomposed with a grating and imaged onto a two-dimensional detector. One dimension of this detector records spectral, and therefore height information, while the other dimension stores the spatial position of the corresponding height values. In experiments on a height standard, it could be shown that the setup is capable of recording multiple height steps of 101 n m over a range of 500 mu m with an accuracy of about 11.5 nm. Further experiments on conductive paths of a micro-electro-mechanical systems (MEMS) pressure sensor demonstrated that the approach is also suitable to precisely characterize nanometer-sized structures on production-relevant components. The main advantage of the proposed measurement approach is the possibility to collect precise height information over a line on a surface without the need for scanning. This feature makes it interesting for a production-accompanying metrology.
引用
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页数:7
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