Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration

被引：0
|
作者：
Fukushima, T. [1 ,2 ,3 ]
Lee, K. W. [2 ]
Tanaka, T. [1 ,4 ]
Koyanagi, M. [2 ]
机构：
[1] Tohoku Univ, Dept Mech Syst Engn, Sendai, Miyagi 9808579, Japan
[2] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi 9808579, Japan
[3] UCLA, Elect Engn Dept, Los Angeles, CA 90095 USA
[4] Tohoku Univ, Dept Biomed Engn, Sendai, Miyagi 9808579, Japan
来源：
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 | 2016年 / 75卷 / 09期
关键词：
3-D INTEGRATION; DIES;
D O I：
10.1149/07509.0285ecst
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for fine-pitch interconnect formation. In addition, "non-transfer stacking", in other word, flip-chip self-assembly and "transfer stacking" called reconfigure-wafer-to-wafer using SAE carrier are explained.
引用
收藏
页码：285 / 290
页数：6
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