Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration

被引：0

作者：

Fukushima, T. ^{[1
,2
,3
]}

Lee, K. W. ^{[2
]}

Tanaka, T. ^{[1
,4
]}

Koyanagi, M. ^{[2
]}

机构：

[1] Tohoku Univ, Dept Mech Syst Engn, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi 9808579, Japan

[3] UCLA, Elect Engn Dept, Los Angeles, CA 90095 USA

[4] Tohoku Univ, Dept Biomed Engn, Sendai, Miyagi 9808579, Japan

来源：

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 | 2016年 / 75卷 / 09期

关键词：

3-D INTEGRATION; DIES;

D O I：

10.1149/07509.0285ecst

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for fine-pitch interconnect formation. In addition, "non-transfer stacking", in other word, flip-chip self-assembly and "transfer stacking" called reconfigure-wafer-to-wafer using SAE carrier are explained.

引用

页码：285 / 290

页数：6

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