Conduction efficiency and strength of electronically conductive adhesive joints

被引：23

作者：

Sancaktar, E ^{[1
]}

Wei, Y

Gaynes, MA

机构：

[1] Clarkson Univ, Ctr Adv Mat Proc, Dept Mech & Aeronaut Engn, Potsdam, NY 13699 USA

[2] IBM Endicott, Endicott, NY 13760 USA

来源：

JOURNAL OF ADHESION | 1996年 / 56卷 / 1-4期

关键词：

electrically conductive adhesives; substrate plating; interphase; electric conduction; joint resistance; joint strength; oxides; surface topography;

D O I：

10.1080/00218469608010510

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Electronically conductive adhesives are being considered as an alternative to solder for interconnection in microelectronics. In order to gain insight regarding electrical and mechanical performance properties of this class of adhesive interconnections, overlap joints were made. Joint resistance and mechanical bond strength were measured before and after environmental stressing.

引用

页码：229 / 246

页数：18