Characterization of Bond Wire Interconnects in QFN Packages

被引：0

作者：

Xiao, Qun ^{[1
]}

机构：

[1] MACOM Technol Solut Inc, Lowell, MA 01851 USA

来源：

2018 48TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2018年

关键词：

plastic packaging; millimeter wave integrated circuits; monolithic integrated circuits;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper discusses models and measurements of bond wire interconnects in Quad-Flat No-lead (QFN) packages. A bond wire interconnect between a 3 mm, 14-lead QFN lead frame and a GaAs chip is used as an example to demonstrate the modelling and measurement process. Measurement results are compared with extracted models and electromagnetic (EM) simulations to verify model and simulation accuracy. Based on the extracted simplified model, theoretical bandwidth limitations of bond wire interconnects are discussed.

引用

页码：1265 / 1268

页数：4

共 13 条

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[3]

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[4]

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