SOLDER FATIGUE IMPACTS OF CONFORMAL COATING FOR TIN WHISKER MITIGATION ON CHIP-SCALE THIN SMALL OUTLINE PACKAGES

被引：0

作者：

Geisler, Karl J. L. ^{[1
]}

机构：

[1] Gen Dynam Adv Informat Syst, Bloomington, MN 55431 USA

来源：

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 | 2010年

关键词：

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This study explores the impact of polyurethane conformal coating on the solder fatigue life of 0.5 mm pitch, thin small outline package (TSOP) components. Test samples were subjected to temperature cycling from -40 degrees C to +100 degrees C. Uncoated samples were tested in addition to sets with 10, 13, and 20 gm thick coatings. Solder joint failure data fit to 3-parameter Weibull distributions demonstrate characteristic fatigue life reductions of 30% with increasing coating thickness but relatively subtle changes to the failure distribution shape.

引用

页码：915 / 920

页数：6

共 3 条

[1] Thermal fatigue life prediction of gull-wing solder joints in plastic thin small outline packages
Lee, SM
Lee, KW
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1996, 35 (11B): : L1515 - L1517
[2] Thermal fatigue life prediction of gull-wing solder joints in plastic thin small outline packages
Samsung Electronics Co, Ltd, Suwon, Korea, Republic of
Japanese Journal of Applied Physics, Part 2: Letters, 1996, 35 (11 B):
[3] Sporadic early life solder ball detachment effects on subsequent microstructure evolution and fatigue of solder joints in wafer-level chip-scale packages
Schambeck S.
Hutter M.
Jaeschke J.
Deutinger A.
Schneider-Ramelow M.
Journal of Microelectronics and Electronic Packaging, 2020, 17 (01): : 13 - 22

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