Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

被引:39
作者
Nishikawa, Hiroshi [1 ]
Mikami, Saya [2 ]
Miyake, Koichi [3 ]
Aoki, Akira [4 ]
Takemoto, Tadashi [1 ]
机构
[1] Osaka Univ, Joining & Welding Res Inst, Ibaraki 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, Suita, Osaka 5650871, Japan
[3] Mitsui Min & Smelting Co Ltd, Ageo 3620021, Japan
[4] Hikoshima Smelting Co Ltd, Shimonoseki, Yamaguchi 7500093, Japan
关键词
copper filler; electrically conductive adhesive; silver coating; electrical resistivity oxidation; RELIABILITY;
D O I
10.2320/matertrans.MJ201020
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electrically conductive adhesives (ECAs) are usually composed of conductive metal fillers and polymeric resin For the metals fillers silver is the most commonly used due to its high electrical and thermal conductivities and chemical stability Recently copper can be a promising candidate for conductive filler metal due to it low resistivity low cost and good electro migration performance In this study to overcome the problem of high electrical resistance associated with the oxidation of copper copper particles were coated with silver and the silver coated copper was tested as a filler metal In particular the effect of silver coating on the electrical resistivity of ECAs just after curing and after reliability tests was investigated It was found that the electrical resistivity of ECA using silver coated copper filler was much lower and more stable than that of ECA using pure copper filler after curing and after reliability tests [doi 10 2320/matertrans MJ201020].
引用
收藏
页码:1785 / 1789
页数:5
相关论文
共 14 条
  • [1] A study of electrically conductive adhesives as a manufacturing solder alternative
    Coughlan, F. M.
    Lewis, H. J.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) : 912 - 921
  • [2] Synthesis and cure kinetics of isotropic conductive adhesives comprising sub-micrometer sized nickel particles
    Goh, CF
    Yu, H
    Yong, SS
    Mhaisalkar, SG
    Boey, FYC
    Teo, PS
    [J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2005, 117 (02): : 153 - 158
  • [3] Electrical characteristics of a new class of conductive adhesive
    Jeong, WJ
    Nishikawa, H
    Itou, D
    Takemoto, T
    [J]. MATERIALS TRANSACTIONS, 2005, 46 (10) : 2276 - 2281
  • [4] Effect of solvent evaporation and shrink on conductivity of conductive adhesive
    Jeong, WJ
    Nishikawa, H
    Gotoh, H
    Takemoto, T
    [J]. MATERIALS TRANSACTIONS, 2005, 46 (03) : 704 - 708
  • [5] Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
    Jiang, HJ
    Moon, KS
    Lu, JX
    Wong, CP
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (11) : 1432 - 1439
  • [6] Characterization of electroplated bismuth-tin alloys for electrically conducting materials
    Kang, SK
    Buchwalter, S
    Tsang, C
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) : 1278 - 1283
  • [7] Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density
    Kim, HK
    Shi, FG
    [J]. MICROELECTRONICS JOURNAL, 2001, 32 (04) : 315 - 321
  • [8] Electroless plating of silver on graphite powders and the study of its conductive adhesive
    Liang Tongxiang
    Guo Wenli
    Yan Yinghui
    Tang Chunhe
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2008, 28 (1-2) : 55 - 58
  • [9] Research of silver plating nano-graphite filled conductive adhesive
    Lin, Wei
    Xi, Xiangrong
    Yu, Chaosheng
    [J]. SYNTHETIC METALS, 2009, 159 (7-8) : 619 - 624
  • [10] Effects of shrinkage on conductivity of isotropic conductive adhesives
    Lu, DQ
    Wong, CP
    [J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2000, 20 (03) : 189 - 193