The effect of electrical current (DC) on gold thin films

被引:25
作者
Aguilar, M [1 ]
Oliva, AI [1 ]
Quintana, P [1 ]
机构
[1] EPN, Unidad Merida, Ctr Invest & Estudios Avanzados, Dept Fis Aplicada, Cordemex 97310, Yucatan, Mexico
关键词
Au; electromigration; STM; thin films; XRD;
D O I
10.1016/S0039-6028(98)00282-9
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We studied changes induced by electrical current (DC) on gold thin films by using a combination of scanning tunnelling microscopy and grazing incidence X-ray diffraction. The results show that the process inducing device failure is based on surface diffusion that produces the growth of microcrystals at the expense of mechanically strained microcrystals. The de-percolation and loss of adherence to the substrate reduce the heat transfer which in turn produce an increase of film temperature. This temperature increase induces a large mechanical stress due to the differential dilatation of substrate and him. The result of these processes is the final failure of current conduction by the him. (C) 1998 Published by Elsevier Science B.V. All rights reserved.
引用
收藏
页码:501 / 511
页数:11
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