共 19 条
- [2] AKIYAMA S, 2002, IEEE 18 INT SEM LAS, P57
- [4] COLDREN LA, 1995, DIODE LASERS PHOTOIC
- [5] COLLIN RE, 1992, FDN MICROWAVE ENG, pCH8
- [7] IRMSCHER S, 2003, THEISS ROYAL I TECHN
- [8] KODOMA S, 2002, EUR C OPT COMM ECOC
- [9] Use of BCB in high frequency MCM interconnects [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01): : 42 - 47